BASF has developed a new engineering plastic that markedly reduces the risk that electronic components will malfunction due to contact with moisture or oil. The electrical conductive paths of these components can be overmolded with the plastic to form a tight seal. The new material, Ultramid Seal-Fit, is a transparent, nonreinforced copolyamide (PA) with very good adhesion to metals as well as to plastics such as Ultramid (PA) and Ultradur (PBT). The material was specially developed for the tight overmolding of metal inserts.
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