The HPC chip series is a surface-mount device with a 0.5 × 0.5 in. footprint capable of 5 W continuous power in free air, using the same amount of board space as typical 3-W SMD wirewound devices. With 200 lfm or 400 lfm air movement, the power rating improves to 10 W and 12.5 W respectively. Power ratings are achieved without exceeding a circuit board temperature of 105°C. The patented heat sink design reduces the number of heat sink pieces from two to one and increases the material thicknesses, while maintaining the exact dimensions of the previous device. The design also simplifies pick and placement and individual part marking. The heat sink is anodized to provide 600 V isolation.
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