Single-Chip Platform Solution
June 2007
 Print this page

The company’s single-chip platform solution is based on the ZigBee specification, designed to deliver the industry’s lowest power consumption and highest performance. The MC1322x platform is engineered to support battery life of up to 20 years, doubling the expectations for current ZigBee solutions. It is available in a Platform in Package (PiP) solution that integrates the essential components of the application within a single package, thereby reducing component count and system cost. The platform contains a 32-bit microcontroller (MCU), a fully compliant IEEE 802.15.4 transceiver, balun, and RF matching components, all integrated into a small-footprint land-grid array (LGA) package. The package is said to virtually eliminate the need for external RF components. The solution also features a TurboLink technology mode, engineered to increase data rates by up to 2 megabits per second between nodes. According to the company, the platform solution is said to be designed for a new class of wireless application that requires faster streaming of audio and data files across an IEEE 802.15.4 or ZigBee network. The devices will switch automatically between the IEEE 802.15.4 protocol and TurboLink technology packets, allowing the developer to take advantage of high-speed capabilities while controlling and monitoring a ZigBee mesh network. Freescale Semiconductor

0


Canon Communications LLC . © 2008