Liquid Adhesive
October 2005
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Liqui-Bond SA (Silicone Adhesive) 2000 is said to be a high-performance, thermally conductive liquid adhesive with dielectric strength of 250 V per mil and thermal conductivity of 2 W/m-K. The adhesive’s formulation is said to keep the material in place until an external force is applied to it, thus eliminating flow after being dispensed. Once applied, the adhesive conforms to the shape of surface components, which increases the contact area. The Bergquist Company

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