Polyimide for Semiconductor Applications
February 2006
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Meldin 7001 polyimide was developed for parts and shapes in semiconductor applications. Key advances in North America and Asia have been made in Meldin replacement rings for the AMAT P-5000 etch machine, which is used in the production of microchips. Meldin 7001 has heat resistance up 600 degrees fahrenheit (315.6 degrees Celcius), machinability and high purity, and it is available in stock shapes for machining or custom molded components. Saint-Gobain Performance Plastics, www.plastics.saint-gobain.com


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