August 2005
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A brochure from TechFilm Corporation highlights the company’s B-staged adhesive technology, company capabilities, and technical data on available film and preform products. The literature was designed to provide assembly solutions for design and manufacturing engineers seeking alternatives to liquid adhesives and solders. The full-color, eight-page brochure includes information on the company’s full line of thermally conductive, electrically conductive, EMI/RFI shielding, and structural B-staged adhesives.

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