July 2004
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The 20-3001 epoxy potting and encapsulating resin is an electronic grade, low viscosity epoxy system with a one-to-one volumetric mix ratio. Since the epoxy system is unfilled, the company says filler settling does not occur in containers or within meter mix and dispensing equipment. Due to its low viscosity, densely populated printed circuit boards are uniformly penetrated, leaving no voids or air pockets. The epoxy also results in a bubble-free and glass-like mirror finish. Epoxies, Etc…

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