"CDMA handset manufacturers now have unprecedented choices to design innovative and competitive cdma2000 wireless products based on these open, standard CDMA chipset solutions from ST and TI," said Gilles Delfassy, senior vice president of TI's wireless business unit. "This will stimulate healthy competition in the CDMA market and fuel the growth and evolution of handset designs, features and roadmaps."
TI and ST say they are uniting elements of their respective technologies into a portfolio of ICs forming CDMA chipsets that target multiple market segments and present handset manufacturers with flexibility and choice through open hardware interfaces, including interfaces to RF subsystems and application processors. An open Application Programming Interface (API) that will facilitate customization of products and accelerate the proliferation of easily portable applications onto this platform provides additional flexibility, the companies say.
The chipsets will also reportedly provide reduced bill-of-materials cost compared to similar offerings, low-power consumption for both standby and talk times, and the benefit of suppliers with world-class production facilities and proven wireless chipset expertise. In addition to the initial CDMA chipset targeting the cdma2000 1X standard, TI and ST claim that handset manufacturers will also have a time-to-market advantage for future cdma2000 1xEV-DV handsets with the industry's first complete chipset for this market.
"To accelerate the growth of the CDMA market, it is essential to give handset manufacturers a choice of competitive solutions and suppliers. By combining our complementary strengths, TI and ST are uniquely positioned to stimulate the rapid growth of this market by jointly offering the most competitive chipset ICs," said Aldo Romano, corporate VP and general manager of ST's Telecommunications, Peripherals and Automotive groups. "Building on the successful relationship between the two leaders, this new cooperation reinforces our joint commitment to driving openness in the mobile terminal market."
In addition to the CDMA chipset solutions, ST and TI say they will make available their own complementary wireless technologies including applications processors, which support the OMAPI standard, wireless LAN, Bluetooth?, and GPS location technology. ST offers Flash memory products as an option to complement the chipset. Both ST and TI offer customers semiconductor manufacturing capabilities with the demonstrated ability to support high-performance, low-power, and cost-effective silicon in high-volume production.