Call for Participation Issued For IPC Tech Conference
Mar 12, 2012
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IPC - Association Connecting Electronics Industries issued a Call for Participation for the technical conference at IPC Midwest. Abstracts need to be submitted by April 2, 2012.

The IPC Midwest Conference & Exhibition takes place Aug. 22-23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, IL.

Researchers, academics, technical experts, and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.

Presentations are sought in the areas of:
* adhesives
* cleaning materials
* conformal coatings
* design for manufacturability
* design for reliability
* design for test
* electronic materials
* fluxes
* handling and storage
* incoming inspection
* interconnection performance
* moisture sensitivity
* optical/laser inspection
* pick and place
* potting and encapsulation
* process control
* printing/jetting
* reflow and wave soldering
* selective soldering
* solders
* solderability
* solder mask
* testing
* tin whiskers risk mitigation
* X-ray inspection

Abstracts must be submitted by April 2, 2012, and should detail case histories, field data, new technologies or innovation, or research and findings. In addition, abstracts should summarize the problems and resolutions, procedures used, results of experiments and benefits to the industry.

Oral presentations will be limited to 20 minutes, plus an additional 10 minutes for questions and answers. Presentations must be noncommercial and focused on technology rather than a company's product and must not have been previously presented.

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