IPC Conference Selects Best International and U.S. Papers
Feb 23, 2012
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IPC - Association Connecting Electronics Industries announced the winners of the Best U.S. and International Papers of IPC Apex Expo 2012. Selected through a ballot process by the event's Technical Program Committee, the papers will be presented at IPC Apex Expo, Feb. 28-March 1, at the San Diego Convention Center.
The International category winning paper is: "Lead-Free Selective Wave Solder Guidelines for Thermally Challenging PCBs" by Ramon Mendez, DFM/process development engineer, Celestica, in Monterrey, Mexico. Co-authors are Ismael Marin, also with Celestica in Mexico, and Helen Lowe, Celestica Toronto, Canada. Mendez's paper will be presented on Wednesday, February 29 in S17 Solder Assembly.
The U.S. category winning paper is: "Investigation of Pad Cratering in Large Flip-Chip BGA Using Acoustic Emission" by Anurag Bansal, Ph.D., reliability engineer, Cisco Systems Inc., San Jose, CA. Dr. Bansal's co-authors, also with Cisco Systems, are Cherif Guirguis and Kuo-Chuan Liu. Dr. Bansal will present his paper during the S31 Pad Cratering technical session on Thursday, March 1.
The Technical Program Committee also awarded three honorable mentions in the International category and one in the U.S. category. Those papers are:
* "Elemental Compositions of Over Two Dozen Cell Phones" by Beverley Christian, Ph.D., Research in Motion Ltd., Ontario, Canada, in session S01 Environmental Compliance
* "A Plasma Deposited Surface Finish for Printed Circuit Boards" by Tim Von Werne, Ph.D., Semblant Ltd, Cambridgeshire, United Kingdom, in session S34 Surface Finishes II
* "Warpage Issues and Assembly Challenges Using Coreless Packaging Substrate" by Jinho Kim, Samsung Electro-Mechanics Co., Ltd., Suwon Gyunggi-Do, South Korea, in session S33 PCB Warpage
* "PCB Trace Impedance Impact of Localized PCB Copper Density" by Gary Brist, Intel Corp., Hillsboro, OR, in session S07 Signal Integrity I.
More than 100 papers were submitted for consideration as Best Paper. Papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations, and the clarity and professionalism of writing.
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