Application Spotlight: Samsung Thin Phones Enabled by Agere Chip Package
Dec 7, 2006
| Print this page
Samsung Electronics has delivered to market the thinnest cell phone ever made. Incorporating Agere Systems' innovative chip packaging design, Samsung could make Ultra Edition 6.9 (X820 bar design) and Ultra Edition 9.9 (D830 clamshell design) cell phones the thinnest ever among its form factors.
The technique is called package-on-package (stacking) in which a packaged memory chip is stacked on top of the baseband chip package to reduce the overall area footprint. This enables single-sided component mounting so the phone itself can be made thinner in depth. Typically, cell phones have chips on both sides of the circuit board, making the cell phones thicker.
The Ultra Edition 6.9 (X820) measures less than one-quarter inch in depth (6.9 millimeters) and weighs only 66 grams. The Ultra Edition 9.9 (D830) measures 9.9 millimeters thick. Both are the world's thinnest of their types, according to Samsung. The cell phones contain Agere's Sceptre HPE 2.5-generation GSM/E-GPRS chip set.
The two models remain full-featured. Each allows the user to listen to songs on a music player, take pictures with a 2 megapixel camera, wirelessly connect using Bluetooth technology, store 80 megabytes worth of data in onboard memory, and display both video and photos stored in their cell phones onto their TV set with a TV-out interface.
Both phones adhere to the 2.5-generation EDGE standard, which transmits data at up to 384 kilobits per second. At that speed, the Samsung phones are three times faster than today's mainstream cell phones, making music and photo downloads over the network much faster.
Back to Breaking News