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Casio and Renesas Technology to Collaborate
Jan 19, 2005
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Consumer electronics maker Casio Computer Co., Ltd. and chip maker Renesas Technology Corp. are in an agreement whereby Casio will license its wafer level package (WLP) semiconductor device packaging technology to Renesas.

The agreement marks the first time Casio has made its WLP technology available to another Japanese semiconductor device manufacturer.

WLP is a new technology for semiconductor devices that enables rerouting of the copper traces and encapsulation of the chips in epoxy resin while the wafer is intact. The technology answers the demand for electronic products that are more compact and offer a high level of performance such as mobile phones and digital cameras.

As part of the agreement, Casio will make its WLP technology available to Renesas on an ongoing basis. Renesas plans to use the technology to fabricate its semiconductor devices. The chip maker will also be authorized to manufacture and sell chip size package products employing WLP, both on its own and through its subsidiaries.

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