IPC has announced a call for papers for the 10th Electronic Circuit World Convention (ECWC 10), which it will host February 21-24, 2005, in conjunction with its co-located IPC SMEMA Council’s APEX/IPC Printed Circuits Expo/IPC Designers Summit exhibition in Anaheim, CA, U.S.
IPC is a Northbrook, IL, U.S.-based trade association which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly.
Every 3 years, the World Electronics Circuits Council (WECC), an international group of related industry trade associations, organizes the ECWC event that creates an outlet for the latest research and innovation by providing a forum for the interchange of technical and management concepts used on a worldwide basis. This event, which attracts the international technologists, rotates around the world as different members of WECC are approved as host organizations. IPC was approved as host of ECWC 10 by the other WECC member associations.
To participate in the four-day convention, IPC must receive a 300-word abstract in English by May 1, 2004 that supplies technical, management, economic, or statistical information.
According to IPC, the selection process is competitive and sufficient detail needs to be included to allow the ECWC 10 Program Committee to assess content of the proposed paper.
Papers are being sought in the following areas:
Marketing and Management
The PCB market in the U.S./Asia/Europe
The electronics market in the Americas/Asia/Europe
Development of new regional market/future applications
Liaisons/trade agreements—case histories
Innovative products introduction
Games to high-performance application extremes
Incorporating green technology in corporate mission
Success strategies for small- to medium-sized companies
Problems complying with environmental legislation
Total quality control: TQM and TQA
Third party quality assessment
Process automation methods
Environmentally-friendly PCBs/PCBAs, Recycling/Reusing/Reducing
EMS Business and supply chain Issues
Automated Web-based manufacturing innovations
Consortia updates, strategic alliances
Internet access for trading partner B2B transactions
Electronic circuits design, Packaging/Jisso design and data-transfer technologies
Board fabrication processes
Surface mount devices and electronics assembly technology
Manufacturing equipment and automation
Optical circuit packaging technology
Environmentally conscious engineering and Eco-Design
Semiconductor packaging technology
Micromechanical Jisso technology
If an abstract is selected, technical papers will be due on November 30, 2004. Each paper should be a minimum of six pages in length, describe significant results from experiments, emphasize new techniques, discuss trends of interest, and contain technical and/or appropriate test results.
In addition, 30-minute paper presentations should also be in English and non-commercial in nature. Each presentation should summarize the paper, while clearly describing significant results and emphasizing new techniques/trends that would be of interest to the attendees.
To submit an abstract or for more information, visit www.ipc.org or contact David Bergman, IPC’s vice president of standards, technology and international relations, at DavidBergman@ipc.org or +1 847/790-5340.
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