Home
Global Supplier Directory
APPLIANCE Engineer
Supplier Solutions
APPLIANCE Line
Whitepaper Library
Calendar of Events
Association Locator
Contents Pages
Market Research
Subscription Center


 
Daily News

Mobile Phone Maker TCL and Analog Devices Form Wireless Development Lab
Feb 27, 2004
 Printable format
 Email this Article
 Search

MA, U.S.) has inked an agreement with Chinese mobile phone developer TCL Mobile Communication Co., Ltd., under which the companies will establish a development laboratory in China.

TCL Analog Devices and TCL have been working together on the development of GSM/GPRS mobile phones that are developed around Analog Devices SoftFone and Othello chipsets as well as TTPCom's wireless software. Through the new center, which will be staffed by both companies, Analog Devices and TCL will work together on the development of next-generation designs.

The development center will be located in Huizhou, China and will be operational by March 1. Financial terms of the deal were not released. (CommsDesign)

Back to Daily News

 

Daily News

...........................................................

Dec 17, 2014: Bosch names Kenny head of marketing

Dec 17, 2014: Multifamily Production Index off its peak, but still positive

Dec 17, 2014: AHRI launches two new certification programs

Dec 16, 2014: Ar├želik awarded for fridge with integrated ice-cream bowl

Dec 16, 2014: Report: appliance segment at the top of 2014 reshoring list

More Daily News>>

RSS Feeds
.........................................................
Appliance Industry
Market Research

...........................................................

November 2014: Appliance Magazine Market Insight Annual Subscriptions
November 2014: U.S. Appliance Industry: Market Value, Life Expectancy & Replacement Picture 2014
October 2014: Portrait of the European Appliance Industry
September 2014: Appliance Industry Focus: HVAC




 
Contact Us | About Us | Subscriptions | Advertising | Home
UBM Canon © 2014  

Please visit these other UBM Canon sites

UBM Canon Corporate | Design News | Test & Measurement World | Packaging Digest | EDN | Qmed | Plastics Today | Powder Bulk Solids | Canon Trade Shows