TransDimension, a provider of USB connectivity solutions for embedded applications, has licensed its USB On-The-Go (OTG) technology to NEC Electronics Corporation (TSE) to integrate into NEC's next-generation Large Scale Integration (LSI) chip for third-generation (3G) mobile phones.
The announcement with NEC Electronics marks TransDimension's entry into the Japanese cellular phone market.
Through TransDimension's USB OTG technology, NEC Electronics will leverage the readily available USB standard to obtain direct connectivity for its 3G phones with other mobile devices and computer peripherals. USB OTG will provide access to other smart devices, such as digital cameras, PDAs, and computer peripherals to exchange data without the aid of a PC.
"The next-generation of mobile phones will be required to offer a rich multimedia experience to the end-user. A necessary part of that experience will be the ability to share data with other users through direct connectivity to other smart devices," said Rick Goerner, TransDimension president and CEO, in a written statement. "NEC will leverage our USB OTG technology to quickly and cost effectively introduce a proven, high performance USB solution into their LSI chip."
to Daily News