The deadline to submit papers for the are 60th Electronic Components and Technology Conference (ECTC), June 2010 in Las Vegas, has been extended to Oct. 23. Papers should represent new developments and knowledge in any advanced packaging, applied reliability, assembly and manufacturing technology, electronic components and RF, materials and processing, optoelectronics, and more.
Abstracts should be no more than 750 words and must be submitted at http://www.ectc.net.
Authors will be notified of paper acceptance with instructions for publication by Dec. 15, 2009.
ECTC is sponsored by the Electronic Components, Assemblies and Materials Association (ECA); the Electronic Industries Alliance (EIA); the IEEE and the IEEE Components, Packaging and Manufacturing Technology Society (CPMT).
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