Home
Global Supplier Directory
APPLIANCE Engineer
Supplier Solutions
APPLIANCE Line
Whitepaper Library
Calendar of Events
Association Locator
Contents Pages
Market Research
Subscription Center


 
Daily News

Application Spotlight: Samsung Thin Phones Enabled by Agere Chip Package
Dec 7, 2006
 Printable format
 Email this Article
 Search

Samsung Electronics has delivered to market the thinnest cell phone ever made. Incorporating Agere Systems' innovative chip packaging design, Samsung could make Ultra Edition 6.9 (X820 bar design) and Ultra Edition 9.9 (D830 clamshell design) cell phones the thinnest ever among its form factors.

The technique is called package-on-package (stacking) in which a packaged memory chip is stacked on top of the baseband chip package to reduce the overall area footprint. This enables single-sided component mounting so the phone itself can be made thinner in depth. Typically, cell phones have chips on both sides of the circuit board, making the cell phones thicker.

The Ultra Edition 6.9 (X820) measures less than one-quarter inch in depth (6.9 millimeters) and weighs only 66 grams. The Ultra Edition 9.9 (D830) measures 9.9 millimeters thick. Both are the world's thinnest of their types, according to Samsung. The cell phones contain Agere's Sceptre HPE 2.5-generation GSM/E-GPRS chip set.

The two models remain full-featured. Each allows the user to listen to songs on a music player, take pictures with a 2 megapixel camera, wirelessly connect using Bluetooth technology, store 80 megabytes worth of data in onboard memory, and display both video and photos stored in their cell phones onto their TV set with a TV-out interface.
   
Both phones adhere to the 2.5-generation EDGE standard, which transmits data at up to 384 kilobits per second. At that speed, the Samsung phones are three times faster than today's mainstream cell phones, making music and photo downloads over the network much faster.
   
 

Back to Daily News

 

Daily News

...........................................................

Nov 21, 2014: Electrolux: new U.S. fridge efficiency requirements are more complex than anticipated

Nov 21, 2014: Whirlpool brand launches Perceptions of Care video

Nov 21, 2014: Hon Hai 3Q profit $1 billion

Nov 21, 2014: Environmental Product Declarations for aluminum product types released

Nov 20, 2014: Report: Drop in affluents' consumer confidence may foretell signal trouble ahead for some retailers

More Daily News>>

RSS Feeds
.........................................................
Appliance Industry
Market Research

...........................................................

November 2014: U.S. Appliance Industry: Market Value, Life Expectancy & Replacement Picture 2014
October 2014: Portrait of the European Appliance Industry
September 2014: Appliance Industry Focus: HVAC
June 2014: Appliance Magazine Market Insight: April 2014




 
Contact Us | About Us | Subscriptions | Advertising | Home
UBM Canon © 2014  

Please visit these other UBM Canon sites

UBM Canon Corporate | Design News | Test & Measurement World | Packaging Digest | EDN | Qmed | Plastics Today | Powder Bulk Solids | Canon Trade Shows