The company's reaction assisted molding process (RAMP) technique is used to securely integrate a radio frequency identification chip and antennae, an integrated circuit and other electronic components, including batteries, into a small form-factor smart card, key fob, smart tag, memory cards, and other portable electronic devices. The technique positions computer chips and electronic components within a mold between two sheets of PVC or polycarbonate film, after which a polyurethane mixture is injected at low temperature and pressure to completely immerse the electronic element. The electronic element is then encapsulated and protected when curing is completed in less then an hour. The technology is said to be flexible enough to be used with PVC, polycarbonate, Teslin™, and a wide range of other materials for specific properties and applications. Gusmer | Decker
Gusmer Decker a Graco Co.