Global Supplier Directory
Supplier Solutions
Whitepaper Library
Calendar of Events
Association Locator
Contents Pages
Market Research
Subscription Center


March 2005
 Printable format
 Email this Article

The 8th edition shortform catalog from Aries Electronics, Inc. highlights the Pin-Ball Socket, which is said to be the first side-stackable BGA socket available on the market. The 12-page catalog also features the Correct-A-Chip™ technology and products, which are said to enable designers to convert virtually any package type or footprint to any other. Data and product information is also provided for RF test sockets, BGA products, LGA sockets, Test & Burn-in sockets, display sockets, cable jumper assemblies, DIP/SIP sockets and headers, programming devices, and other socket packages.


Contact Us | About Us | Subscriptions | Advertising | Home
UBM Canon © 2015  

Please visit these other UBM Canon sites

UBM Canon Corporate | Design News | Test & Measurement World | Packaging Digest | EDN | Qmed | Plastics Today | Powder Bulk Solids | Canon Trade Shows