The Open Door
Ecodesign of Energy Using Products
by Glenn Goetz, product compliance manager, Maytag International, Inc.
Partial Switching Power Factor Correction Module
by Ki-Young Jang, Yo-Chan Son, Man-Kee Kim, Sung-Il Yong, and Bum-Seok Suh, Fairchild Semiconductor
This paper introduces an integrated power module for a partial switching power factor correction circuit (PSP) used in air-conditioning systems. The proposed module incorporates two insulated gate bipolar transistors (IGBTs) and rectifier diodes, along with a gate-driving low-voltage integrated circuit (LVIC) and a thermistor for temperature monitoring, all of which are integrated into a direct-bonded-copper (DBC) based transfer-molded package. It is intended for use in inverter systems of low-power air-conditioners and is expected to provide compactness, reliability, and electrical and thermal performance.
Endicott Research Group is offering a family of DC-AC inverters that feature a vacuum-encapsulated design to ensure cold cathode fluorescent lamp (CCFL) ignition.
APPLIANCE ENGINEER - Electronics Report Engineering
Reaction-Assisted Molding Process
Developed as an offshoot of the existing reaction injection molding (RIM) molding technology, the new reaction-assisted molding process (RAMP) is used to encapsulate electronics into smart cards without requiring the traditional layering manufacturing process.
Laundry Appliances Engineering
Designed for Humans
Whirlpool India used advanced feasibility studies to optimize the ergonomics of a new washer design.